Specifications
Future Specifications
PCI-SIG members have the opportunity to review and comment on draft specifications and ECNs. The following specifications are currently under Membership Review:
- Component Measurement and Authentication (CMA) ECR
- Data Object Exchange (DOE) ECR
- Deferrable Memory Write (DMWr) ECR
- _DSM Additions for PCIe SSD Status LED Management ECR
- _DSM Function Revision Clarifications ECR
Available Specifications
PCI-SIG specifications define serial expansion buses and related components required to drive fast, efficient transfers between processors and peripheral devices.
- PCI Express External Cabling Specification Revision 3.0, Version 1.0
- PCI Express Card Electromechanical Specification Revision 4.0, Version 1.0
- PCI Express Architecture Configuration Space Test Specification Revision 4.0, Version 1.0
- PCI Express Architecture Link Layer and Transaction Layer Test Specification Revision 4.0, Version 1.0
- PCI Express Architecture PHY Test Specification Revision 4.0, Version 1.0
- PCI Express M.2 Specification Revision 3.0, Version 1.2
- PCI Express Base Specification Revision 5.0, Version 1.0
- PCI Express SFF-8639 Module Specification, Revision 3.0, Version 1.0
- PCI Express Base Specification Revision 4.0, Version 1.0
- PCI Express Base Specification Revision 3.1a
- PCI Express Card Electromechanical Specification 3.0
- PCI Express OCuLink Specification Revision 1.0
- PCI Express Mini Card Electromechanical Specification 2.1
Click here for additional Specifications.
Upcoming Events
PCI-SIG events range from educational sessions to compliance programs. Additional information about the following upcoming events and more can be found here.
Become a Member
PCI-SIG is committed to the development and enhancement of the PCI standard. Crediting its success to the contribution of nearly 800 members, PCI-SIG strives to provide them with the resources needed to remain competitive.
Already a member? To log in, or to create a new user log in, click here.