Author’s Note: This blog discusses new functionality introduced in the PCIe 6.0 specification, but please note that the PCIe 6.0.1 and PCIe 6.1 specification revisions have been published.

By: Hope Bovenzi, Strategic Marketing, Astera Labs

The PCI Express^® (PCIe^®) 6.0 specification will provide multiple features, including Transaction Layer Packet (TLP) payload, encoding and decoding, shared credit pooling, Forward Error Correction (FEC), CRC error correction, and more.

Many online resources cover the history and current state of industry development for the concept that, in Integrity and Data Encryption (IDE), we refer to as a Trusted Execution Environment (TEE).

With the widespread adoption of compute-intensive workloads – such as artificial intelligence and machine learning – in enterprise and cloud data centers, high-speed, low-latency interconnects like PCI Express^® architecture are required to connect high-performance nodes.

The upcoming PCI Express^® (PCIe^®) 6.0 specification will continue PCI-SIG’s^® longstanding history of innovation for the next generation of products to keep up with evolving needs in a wide range of markets.

I am happy to share that PCI-SIG^® has begun developing the PCI Express^® (PCIe^®) 6.0 specification, targeted for release in 2021.

PCI-SIG^® is proud to announce that we have established a working relationship with DMTF to simplify hardware management.