PCIe CEM Thermal Reporting ECN
This ECN specifies changes to the PCI Local Bus Specification Revision 3.0 and the PCI Express CEM Specification 3.0. Changes to the PCI Local Bus Specification cover a new VPD encoding and a 32-bit field. Changes to the PCI Express CEM Specification cover a series of graphs used to classify air flow impedance and thermal properties under varying conditions as well as the test figure and process to create these graphs for a given adapter add-in card.
Adapter add-in card types supported by this include all SINGLE-SLOT and DUAL-SLOT PCIe CEM adapter add-in cards without integrated air movers, including standard height adapter add-in cards as well as low-profile adapter add-in cards). Adapter add-in cards with an integrated air mover were not addressed due to the added complication of their integrated air mover in the overall platform’s potential cooling redundancy.