Webinars

Upcoming Webinars:

Past Webinars:

Adoption of PCIe® Technology in IoT Applications Webinar

August 11, 2021

8:00 am – 9:00 am PDT

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The Internet of Things (IoT) represents a wide range of diverse systems spanning edge/ gateway, data acquisition devices, automotive, modular computers, industrial PC and more. One of the characteristics of the emerging edge and IoT market is the exponential growth in data. Most of that data will be processed, stored, and analyzed at the edge to help deliver better latency, conserve network bandwidth, and improve reliability, security and privacy.  As data growth explodes, high bandwidth I/O capabilities along with AI will become necessary to transport and transform this data into actionable information and valuable insights. 

In this webinar, attendees will learn about the role the high bandwidth, low latency PCI Express (PCIe) interconnect technology plays as the primary I/O interconnect in the IoT space. We will review how PCIe architecture is used in the following IoT segments: Edge Computing, Test Equipment, Embedded/Industrial PCs and Automotive.

Participants

  • Debendra Das Sharma (Intel)
  • Anil Kumar (Intel)

PCIe® Technology for Automotive Functional Safety

June 16, 2021

8:00 – 9:00 am PST

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As vehicles continue to become more advanced, functional safety is required as end-to-end measures to maintain vehicle safety in applications including Advanced Driver Assistance Systems (ADAS) and autonomous vehicles. With the expansion of PCI Express® (PCIe®) technology in automotive use cases, functional safety is integrated throughout the system, components and the development lifecycle of both components and system.

In this presentation, attendees will learn how PCIe technology enables safety-critical applications, including Automotive Safety Integrity Level (ASIL) targets for automotive applications such as In-Vehicle Infotainment (IVI), ADAS, and Automated Driving Systems (ADS). The talk also will cover system-level safety architectures and PCIe specification safety features, including where PCIe architecture is used in vehicles, the types of safety-critical data it carries and the importance of RAS functionality. Finally, attendees will learn System on a Chip (SoC) and component-level safety mechanisms to meet ASIL targets and ensure automotive functional safety.

Participants:

  • Thierry Beaumont, Functional Safety Architect, Intel
  • Ron DiGuiseppe, Automotive IP Segment Manager, Synopsys
  • Stephanie Friederich, Systems Engineer, Intel

An Introduction to PCIe® Technology in Automotive Applications

April 7, 2021

8:00 – 9:00 am PST

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The adoption of PCI Express® (PCIe®) architecture in the automotive market is expanding in new AI based Advanced Driver Assistance Systems (ADAS) and infotainment automotive applications, as well as autonomous vehicles. PCIe technology provides high bandwidth, low latency links within the processing units for ADAS and infotainment systems. PCIe technology is also quickly becoming the standard interface for modules housing 4G/5G subsystem. Finally, PCI Express architecture offers reliable connectivity and the vast technology ecosystem needed to support automotive applications of the future.

In this presentation, attendees will learn how PCIe technology is enabling the automotive infotainment and connectivity ecosystem and receive an overview of critical safety applications. The presentation will take a deep dive into the various automotive use cases and the role of PCIe technology in shaping the future of automotive system integration.

Seamless Transition to PCIe® 5.0 Technology in System Implementations

December 9, 2020 and December 10, 2020

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View Recorded Mandarin Webinar

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Compute-intensive workloads, such as Artificial Intelligence and Machine Learning, are being widely adopted in enterprise and cloud data centers, requiring high-performance, purpose-built nodes connected over high speed, low latency interconnects such as PCI Express® (PCIe®) architecture. The upgrade from PCIe 4.0 to PCIe 5.0 technology doubles the bandwidth from 16GT/s to 32GT/s but also suffers greater attenuation per unit distance, impacting signal reach and system topology challenges. This technical webinar explores changes between PCIe 4.0 and PCIe 5.0 specifications, including signal integrity and system design challenges, where the right balance must be found between PCB materials, connector types and the use of signal conditioning devices for practical compute topologies.

Through an objective analysis, the goal is to provide the audience with a methodology to optimize signal and link integrity performance, present best practices for system board design to support PCIe 5.0 technology applications, and test for system level interoperation. Finally, to improve link uptime and maximize the potential of PCIe architecture throughput and latency, we explore the relationship between Lane BER and Link stability.

在系统实施中无缝过渡到PCIe® 5.0

计算密集型工作负载(例如人工智能和机器学习)受到企业和云数据中心广泛采用,需要通过高速、低延迟的互连架构如PCI Express®(PCIe®)连接高性能、专用的节点。从PCIe 4.0升级到PCIe 5.0技术使得带宽从16GT/s倍增至32GT/s,但同时信号的衰减也更大,从而对信号传输距离和系统拓扑挑战造成影响。本次技术网络研讨会探讨了PCIe 4.0和PCIe 5.0规范之间的变化,包括信号完整性和系统设计带来的挑战。在实际应用中,这些变化必须在PCB材料、连接器类型和信号调节器件之间找到适当的平衡。

通过客观分析,最终目标是为与会者提供一种优化信号和链路完整性性能的方法,为支持PCIe 5.0技术应用的系统板设计提供最优方法,并测试系统级互操作性。最后,为了提高链路正常运行时间且最大程度的发挥PCIe架构吞吐量和延迟的潜力,我们也探索了信道误码率(Lane BER)与链路稳定性之间的关系。

在系統實施中無縫轉移至PCIe® 5.0技術

運算密集型工作負載(如人工智慧、機器學習)受到企業和雲端資料中心廣泛採用,需要透過高速、低延遲的互連架構如PCI Express®(PCIe®)連接高效能、專用節點。從PCIe 4.0升級至PCIe 5.0技術將頻寬從16GT/s增加一倍至32GT/s,但同時每單位距離的訊號衰減也更大,對訊號傳輸距離和系統拓撲挑戰造成影響。本次線上技術研討會將探討PCIe 4.0和PCIe 5.0規範之間的變化,包括訊號完整性和系統設計帶來的挑戰。在實際運算拓撲中,這些變化必須在PCB材料、連接器類型和訊號調節裝置之間找到適當的平衡。

透過客觀分析,最終目標是為觀眾提供一種優化訊號和鏈路完整性效能的方法,為支援PCIe 5.0技術應用的系統板載設計提供最佳實踐方式,並測試系統級互通性。最後,為了提升鏈路正常運行時間,並最大程度發揮PCIe架構吞吐量和延遲的潛能,我們也將探討通道位元錯誤率(Lane BER)與鏈路穩定性之間的關係。

Participants

  • Jonathan Bender, Casey Morrison of Astera Labs presented the English version
  • Liang Liu of Astera Labs presented the Mandarin version

Integrity and Data Encryption (IDE) ECN Deep Dive

August 25, 2020
9:00 – 10:00AM PT

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Developers must focus on a wide number of considerations when securing the wide spectrum of systems, devices and components. Not only must they protect key assets against a litany of attacks, but they must also prioritize securing the entire component lifecycle. Over the past few years, PCI-SIG® has focused on optimizing security features within the PCI Express® library of specifications. This webinar will focus on the key aspects of the latest emerging security ECN: Integrity and Data Encryption (IDE).

Attendees learned about the next level details of motivations and use models, including Link vs. Selective, how security is managed, required elements outside of PCIe® technology including software, system construction and industry infrastructure. The webinar also provided an overview of Device’s responsibilities in maintaining security, such as how keys must be secured, paths around encryption eliminated/blocked and how to handle debug. Finally, the webinar outlined specific areas for feedback such as key size and key programming protocol.

Participants:

  • David Harriman, PCI-SIG Protocol Work Group Chair, Intel

August 5, 2020
8:00 – 9:15AM CST / 9:00AM – 10:15AM EST

PCI Express® (PCIe®) architecture has provided the I/O connectivity for computing, communication, and storage platforms satisfying the power-efficient and low-latency requirements of cloud, enterprise, PC, embedded, IoT, automotive, and mobile market segments for two decades. However, the demand for additional performance in power constrained devices and data-hungry server, client, embedded, cloud and edge segments keeps increasing. To continue to meet the performance needs of these segments, PCI-SIG® continues its nearly three decade history of successfully delivering performance doubling with the development of the upcoming PCIe 6.0 specification.

Attendees will learn more about what is driving the quick transition to PCIe 6.0, including an updated specification release timeline. The webinar will feature a deep dive into the PCIe 6.0 architecture metrics. It introduces the approach PCIe 6.0 specification is taking to offer new features like PAM4 encoding and FEC, while preserving its low-latency characteristics required for a Load-Store interconnect and full backwards compatibility.

In this webinar replay at a new APAC-friendly time, members will be able to participate in a live Q&A with the presenter.

Participants:

  • Dr. Debendra Das Sharma, PCI-SIG Board member and an Intel Fellow and Director of I/O Technology and Standards Group
June 4, 2020
8:00 – 9:00AM PT
 

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PCI Express® (PCIe®) architecture has provided the I/O connectivity for computing, communication, and storage platforms satisfying the power-efficient and low-latency requirements of cloud, enterprise, PC, embedded, IoT, automotive, and mobile market segments for two decades. However, the demand for additional performance in power constrained devices and data-hungry server, client, embedded, cloud and edge segments keeps increasing. To continue to meet the performance needs of these segments, PCI-SIG® continues its nearly three decade history of successfully delivering performance doubling with the development of the upcoming PCIe 6.0 specification.

In this webinar, attendees learned more about what is driving the quick transition to PCIe 6.0, including an updated specification release timeline. The webinar will feature a deep dive into the PCIe 6.0 architecture metrics. It introduced the approach PCIe 6.0 specification is taking to offer new features like PAM-4 encoding and FEC, while preserving its low-latency characteristics required for a Load-Store interconnect and full backwards compatibility.

Participants:

  • Dr. Debendra Das Sharma, PCI-SIG Board member and an Intel Fellow and Director of I/O Technology and Standards Group

Emerging Form Factors: EDSFF Overview
April 8, 2020
8:00 – 9:00AM PT

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Enterprise & Data Center SSD Form Factor (EDSFF) is one of the newest form factors to emerge in recent years. Its goal is to develop a stronger data center system-optimized design than traditional SSD form factors like M.2 or U.2. EDSFF has shown that it’s able to meet customer need for storage devices with its high density, capacity and performance.

This webinar will include an overview of the relationship between EDSFF and the PCI Express® (PCIe®) specifications and discuss various use cases for E1.L, E1.S and E3. Finally, they will outline the step-by-step process of how you can build a drive utilizing EDSFF form factors.

Participants:

  • Tom Friend, President and CEO at Illuminosi
  • Jonmichael Hands, Sr. Strategic Planner, Product Manager at Intel
  • Jonathan Hinkle, Executive Director and Distinguished Researcher - Systems Architecture at Lenovo

Retimers to the Rescue: PCI Express® Specifications Reach Their Full Potential
October 9, 2019
8:00 – 9:00AM

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As PCI Express® specifications continue to double the transfer rates of previous generations, the technology can address a variety of needs for data-demanding applications. However, along with the progression of PCIe® specifications, challenges like signal integrity and channel insertion loss arise as well. Retimers are mixed signal analog/digital devices that are protocol-aware and have the ability to fully recover data, extract the embedded clock and retransmit a fresh copy of the data using a clean clock. These devices are fully defined in the PCI Express base specification and are used to combat issues that PCI Express technology faces.

In this PCI-SIG® hosted webinar, Kurt Lender of Intel and Casey Morrison of Astera Labs will offer solutions to conquer signal integrity and channel insertion loss challenges, explain the diagnostic capabilities of retimer technology and more.

Participants:

  • Kurt Lender is the Senior Ecosystem Enabling Manager for Intel Corporation and a Marketing Workgroup Chair at PCI-SIG
  • Casey Morrison is the head of Systems and Applications at Astera Labs and a PCI-SIG member